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Copper Alloy (CuNi2SiCr) Spherical Powder

Product Code : 3D-CuNi2SiCr-CU-PO1

CuNi2SiCr has got even higher strength and hardness than CuCr1Zr at a slightly lower thermal and electrical conductivity. 

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Product Product Code Purity Size Contact Us
CuNi2SiCr Spherical Powder3D-CuNi2SiCr-CU-PO1Customize0-15μm
CuNi2SiCr Spherical Powder3D-CuNi2SiCr-CU-PO2Customize15-53μm
CuNi2SiCr Spherical Powder3D-CuNi2SiCr-CU-PO3Customize45-105μm
CuNi2SiCr Spherical Powder3D-CuNi2SiCr-CU-PO4Customize75-150μm
CuNi2SiCr Spherical Powder3D-CuNi2SiCr-CU-PO5CustomizeCustomize

Copper Alloy (CuNi2SiCr) Spherical Powder Synonyms

C180, C18000, Copper Chrome Silicon Nickel Alloy, Chromium/Nickel/Silicon Copper, CuNiSiCr, Copper Nickel Silicon Chromium Alloy, Nickel Silicon Chromium Copper, Beryllium Free Copper alloy, CuCrNi2Si, CuNi2SiCr

Copper Alloy (CuNi2SiCr) Spherical Powder Chemical Composition [ wt.% ]

Element               Min             Max 

Ni                        2.0             3.0

Si                        0.5             0.8

Cr                       0.2             0.5

Fe                                         0.15

Mn                                        0.1

Pb                                         0.02

other                                     0.1

Cu                     Balance       Balance

CuNi2SiCr Spherical Powder Particle Size

0-15μm, 5-25μm, 15-45μm, 15-53μm, 45-75μm, 45-105μm, 75-150μm. (Various granularities can be customized according to customer requirements)

CuNi2SiCr Spherical Powder Particle Size Description

● 0-15μm (D10=3~5μm, D50=6~10μm, D90=12~14μm)

● 5-25μm (D10=5~10μm, D50=15~20μm, D90=20~25μm)

● 15-45μm (D10=15~20μm, D50=25~30μm, D90=35~40μm)

● 15-53μm (D10=15~20μm, D50=25~35μm, D90=45~50μm)

● 45-75μm (D10=45~55μm, D50=55~65μm, D90=70~75μm)

● 45-105μm (D10=50~60μm, D50=75~85μm, D90=95~105μm)

● 45-150μm (D10=55~70μm, D50=110~120μm, D90=140~150μm)

● 75-150μm (D10=80~90μm, D50=110~125μm, D90=135~150μm)

Copper Alloy (CuNi2SiCr) Spherical Powder

Copper Alloy (CuNi2SiCr) Spherical Powder

CuNi2SiCr Spherical Powder Applicable processes

-Laser/electron beam additive manufacturing (SLM/EBM)

-Injection molding (MIM)

-Hot isostatic pressing (HIP)

-Powder metallurgy (PM)

-Spraying (SP) and other processes.

Other Copper Based Alloys

Copper Based Alloys
StandardNominal CompositionApplication
C70320 CW112CCuNi3SiHigh Conductibility
C18000 CW111CCuNi2SiCrHigh Conductibility
C18150 CW106CuCrZrWear Resistance
OFHC CuCu 99.99% O<300 ppmHighest Level of Purity
OFHC CuCu High OxygenModified for Specific Laser
CWx (Modified)Adjusted CompositionCustomer Specific

Packing of CuNi2SiCr Spherical Powder

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’CuNi2SiCr Spherical Powder is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.

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