Sputtering Targets & Evaporation Materials

Sputtering Target

Deposition materials include sputtering targets, evaporation materials, and Evaporation Sources. Sputtering is one of the main techniques for preparing thin-film materials, which uses ions generated by ion sources to form high-velocity ion beams through accelerated aggregation in a vacuum, pounding the solid surface and undergoing kinetic energy exchange, making the yard of the solid surface leave the solid and deposit on the substrate surface. The bombarded solids are raw materials for the deposited thin film by a sputtering method, called sputtering targets. Vacuum evaporation is putting the workpiece and coating material to be plated in the vacuum room, vacuuming, and then heating the evaporation material to be evaporated and deposited on the workpiece surface. The coating material used is called the evaporative material.ATT specializes in producing high density, ultra high purity (99.9% to 99.9999%) sputtering targets and other deposition materials for all applications using both vacuum melt/casting and hot isostatic pressing (HIP) technology.

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What is Sputtering?

Sputtering is a physical vapor deposition (PVD) process used to deposit thin films of materials onto a substrate. In this process, ions from a plasma are accelerated and directed towards a target material. When these ions hit the target's surface, they dislodge atoms or molecules from the target through a phenomenon called sputtering. These dislodged particles then travel through a vacuum and deposit onto a substrate, forming a thin film.

Sputtering Target Manufacturer

We are a specialized supplier:

Ultra-high-purity forms of each element

Metal ,alloys, superalloys, and metal parts

Bulk chemicals, research compounds and catalysts

Rare earths

Ceramic

Nanomaterials such as nanoparticles and graphene

Sputtering targets and evaporation materials

Organometallics

Pharmaceutical precursors