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Cesium Sputtering Target

Product Code : ME-Cs-5N-SF

ATT specializes in producing high-purity cesium sputtering targets with the highest density and smallest average grain size for semiconductor, chemical Vapor deposition (CVD) and physical Vapor deposition (PVD) displays and optical applications. Our standard sputtering targets for thin films are available in single or combined flat target sizes and configurations up to 820 mm, with borehole positions and threads, bevels, grooves and backings, designed for use with older sputtering equipment as well as the latest process equipment, such as large area coatings for solar or fuel cell and flip-chip applications. We offer all standard gun targets in a variety of shapes and configurations, including round, rectangular, ring, oval, "dog bone", rotable (swivel), Dova and other standard, custom and research size sizes. All targets were analyzed using best-in-class demonstration techniques, including X-ray fluorescence (XRF), glow discharge mass spectrometry (GDMS) and inductively coupled plasma (ICP). "Sputtering" allows deposition of an ultra-high purity sputtered metal or oxide film on another solid substrate, controlled removal of the target material by ion bombardment and conversion to a directed gas/plasma phase. The material is produced by ultra-high purification process such as crystallization, solid state and sublimation. ATT specializes in the production of custom compositions for commercial and research applications as well as new proprietary technologies. Please contact us using the link above to request a quote stating any specifications and total quantities you may require.

ATT is a professional supplier of cesium sputtering targets, and we also manufacture sheets, balls, ingots, balls, sheets, powders, rods, wires, sputtering targets, and many other forms and custom shapes. Other shapes are available upon request.

Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Product Product Code Purity Size Contact Us
Cesium Sputtering Target ME-Cs-2N-SF 99% Customized
Cesium Sputtering Target ME-Cs-3N-SF 99.9% Customized
Cesium Sputtering Target ME-Cs-4N-SF 99.99% Customized
Cesium Sputtering Target ME-Cs-5N-SF 99.999% Customized

Product Information

ATT specializes in producing high-purity cesium sputtering targets with the highest density and smallest average grain size for semiconductor, chemical Vapor deposition (CVD) and physical Vapor deposition (PVD) displays and optical applications. Our standard sputtering targets for thin films are available in single or combined flat target sizes and configurations up to 820 mm, with borehole positions and threads, bevels, grooves and backings, designed for use with older sputtering equipment as well as the latest process equipment, such as large area coatings for solar or fuel cell and flip-chip applications. We offer all standard gun targets in a variety of shapes and configurations, including round, rectangular, ring, oval, "dog bone", rotable (swivel), Dova and other standard, custom and research size sizes. All targets were analyzed using best-in-class demonstration techniques, including X-ray fluorescence (XRF), glow discharge mass spectrometry (GDMS) and inductively coupled plasma (ICP). "Sputtering" allows deposition of an ultra-high purity sputtered metal or oxide film on another solid substrate, controlled removal of the target material by ion bombardment and conversion to a directed gas/plasma phase. The material is produced by ultra-high purification process such as crystallization, solid state and sublimation. ATT specializes in the production of custom compositions for commercial and research applications as well as new proprietary technologies. Please contact us using the link above to request a quote stating any specifications and total quantities you may require.

ATT is a professional supplier of cesium sputtering targets, and we also manufacture sheets, balls, ingots, balls, sheets, powders, rods, wires, sputtering targets, and many other forms and custom shapes. Other shapes are available upon request.


Synonyms

Caesium

Cesium Sputtering Target Properties (Theoretical)

Molecular Weight132.9
AppearanceSolid
Melting Point301.59 °K 28.44 °C   83.19 °F
Boiling Point944 °K 671 °C 1240 °F
Density1.93 g·cm−3
Solubility in H2ON/A
Electrical Resistivity(20°C) 205 nΩ·m
Electronegativity0.79 (Pauling scale)
Heat of Vaporization63.9 kJ·mol
Poisson's RatioN/A
Specific HeatN/A
Tensile StrengthN/A
Thermal Conductivity35.9 W·m−1·K−1
Thermal Expansion(25 °C) 97 µm·m-1·K-1
Vickers HardnessN/A
Young's Modulus1.7 GPa


Applications of Cesium Sputtering Target

Zinc is also used in alloys such as brass, nickel silver and aluminium solder. Zinc oxide is widely used in the manufacture of very many products such as paints, rubber, cosmetics, pharmaceuticals, plastics, inks, soaps, batteries, textiles and electrical equipment.


Packing of Cesium Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L)s quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’Cesium Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.

Chemical Identifiers

Linear FormulaCs
MDL NumberMFCD00134037
EC No.231-155-4
Beilstein/Reaxys No.N/A
Pubchem CID5354618
IUPAC Namecesium
SMILES[Cs]
InchI IdentifierInChI=1S/Cs
InchI KeyTVFDJXOCXUVLDH-UHFFFAOYSA-N
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