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Copper Plate (Cu Plate)

Product Code : ME-Cu-6N-SP

ATT specializes in producing Copper Plates in various thicknesses and sizes. Most plates are cast for use in coating and thin film Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Organometallic and Chemical Vapor Deposition (MOCVD) for specific applications such as fuel cells and solar energy. Thicknesses start at 0.25" for all metals. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. ATT specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. ATT also casts any of the rare earth metals and most other advanced materials into rod, bar, or plate form, as well as other machined shapes and through other processes such as nanoparticles and in the form of solutions and organometallics. We also produce copper as rods, powder and plates. Other shapes are available by request.

Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Product Product Code Purity Size Contact Us
Copper PlateME-Cu-2N-SP99%Customized
Copper PlateME-Cu-3N-SP99.9%Customized
Copper PlateME-Cu-4N-SP99.99%Customized
Copper PlateME-Cu-5N-SP99.999%Customized
Copper PlateME-Cu-6N-SP99.9999%Customized

Product Information

ATT specializes in producing Copper Plates in various thicknesses and sizes. Most plates are cast for use in coating and thin film Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Organometallic and Chemical Vapor Deposition (MOCVD) for specific applications such as fuel cells and solar energy. Thicknesses start at 0.25" for all metals. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. ATT specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. ATT also casts any of the rare earth metals and most other advanced materials into rod, bar, or plate form, as well as other machined shapes and through other processes such as nanoparticles and in the form of solutions and organometallics. We also produce copper as rods, powder and plates. Other shapes are available by request.


Synonyms

Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper

Copper Plate Specification

Dimensions

Size: Thicknesses start at 0.25" for all metals.

Purity: >=99.0%, 99.5%, 99.9%, 99.99%, 99.995%,99.999%, 99.9999%。

Per your request or drawing

We can customized as required


Copper Products

MaterialsNi
Plate
Sheet
Strip
Rod
Sputtering Target
Tube

Other: Spherical Copper Powder, Copper crucibles, Copper nuts, Copper  bolts, Copper heating elements, and Copper shielding screens.


Properties(Theoretical)

Molecular Weight63.55
AppearanceReddish Metal
Melting Point1085 °C
Boiling Point2562 °C
Density8.96 g/cm3
Solubility in H2ON/A
Electrical Resistivity1.673 μΩ-cm @ 20 °C
Electronegativity1.90 Paulings
Heat of Fusion13.26 kJ ·mol-1
Heat of Vaporization300.4 kJ ·mol-1
Poisson's Ratio0.34
Specific Heat0.39 kJ/kg K
Thermal Conductivity401 W ·m-1 ·K-1
Thermal Expansion(25 °C) 16.5 µm·m-1·K-1
Vickers Hardness369 MPa
Young's Modulus110–128 GPa


Applications of Copper Plate

Because of its special metal characteristics, high conductivity and corrosion resistance, copper plate is widely used in conductive, thermal and corrosion resistant equipment. Such as wire, cable, conductive screw, blasting detonator, chemical evaporator, storage and various pipes.


Packing of Copper Plate

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’Copper Plate is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.

Chemical Identifiers

Linear FormulaCu
CAS7440-50-8
MDL NumberMFCD00010965
EC No.231-159-6
Beilstein/Reaxys No.N/A
Pubchem CID23978
SMILES[Cu]
InchI IdentifierInChI=1S/Cu
InchI KeyRYGMFSIKBFXOCR-UHFFFAOYSA-N




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