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Copper Foam

Product Code : FO-Cu-5N-CU

Copper foam is a rigid, three-dimensional network of interconnected copper ligaments that form cells with open pores.  Copper Foam contains completely solid ligaments (as opposed to sintered or hollow ligaments) which makes it stronger and more thermally conductive. Its properties are fully customizable, which allows its performance characteristics to be optimized for a broad range of applications. It is commonly used in applications that benefit from very high thermal conductivity and surface area, and from the nature-mimicking morphology of the rigid cellular structure.

Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Product Product Code Purity Size Contact Us
Copper foamFO-Cu-2N-CU99%Customized
Copper foamFO-Cu-3N-CU99.9%Customized
Copper foamFO-Cu-4N-CU99.99%Customized
Copper foamFO-Cu-5N-CU99.999%Customized

Product Information

Copper foam is a rigid, three-dimensional network of interconnected copper ligaments that form cells with open pores.  Copper Foam contains completely solid ligaments (as opposed to sintered or hollow ligaments) which makes it stronger and more thermally conductive. Its properties are fully customizable, which allows its performance characteristics to be optimized for a broad range of applications. It is commonly used in applications that benefit from very high thermal conductivity and surface area, and from the nature-mimicking morphology of the rigid cellular structure.

 

Synonyms

Foamy copper, porous copper, Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper

Copper Foam Specification

Dimensions

Size: customized

Per your request or drawing

We can customized as required

 

Properties(Theoretical)

Molecular Weight63.55
AppearanceReddish Metal
Melting Point1085 °C
Boiling Point2562 °C
Density8.96 g/cm3
Solubility in H2ON/A
Electrical Resistivity1.673 μΩ-cm @   20 °C
Electronegativity1.90 Paulings
Heat of Fusion13.26 kJ ·mol-1
Heat of Vaporization300.4 kJ ·mol-1
Poisson's Ratio0.34
Specific Heat0.39 kJ/kg K
Thermal Conductivity401 W ·m-1   ·K-1
Thermal Expansion(25 °C) 16.5   µm·m-1·K-1
Vickers Hardness369 MPa
Young's Modulus110–128 GPa


Physical Characteristics of Copper Foam (8% Relative Density): (Theoretical)

Compressive   strength131psi0.903MPa
Tensile   strength1000psi6.9 MPa
Shear strength190psi1.31 MPa
Vickers   hardness35
Specific heat0.385J/g-℃.092 BTU/lb-0F
Thermal   expansion coefficient1.7×10-5 m /   m-°C (0-100°C)9.44×   10-6in/in--F
Modulus of   elasticity (tension)14.6 × 103 psi101.84  MPa
Modulus of   Elasticity(Compression)*107 kpsi(736  MPa)
Shear  Modulus40.9 kpsi(282  MPa)
Bulk Thermal   Conductivity5.84   BTU/ft-hr-F(10.1 W/m-C)
Coefficient of   Thermal Expansion(0-100°℃)9.44×   10-6in/in--F(1.7×10-5m/m--C)
Bulk   Resistivity2.56×10-5ohm-in(6.5×10-5ohm-cm)



Advantages

Copper Foam, also known as foamed copper, is primarily used in applications with high thermal performance requirements, such as heat exchangers, that exceed the capabilities of  Aluminum Foam.

- High thermal conductivity

- High surface area per unit volume

- Creates turbulence in flowing fluids which minimizes boundary layers and promotes mixing to enhance thermal performance

- Custom conformal shapes/geometries to optimize size and weight


Characteristics

- Low Density

- High Strength to Weight Ratio

- High Surface area to Volume Ratio

- Isotropic load response

- Controlled stress-strain Characteristics

- Can be Heat Treated

- Brazable

- Can be coated and plated


Copper Foam Applications 

* Electrode material

Copper foam has excellent electrical conductivity, which makes it widely used as electrode frame materials for new batteries such as nickel-zinc batteries and electric double-layer capacitors.

* Catalyst

Copper foam acts as a catalyst in many organic chemical reactions, such as directly replacing perforated copper plates as a chemical reaction catalyst. Foamed copper has also been successfully used as a carrier for photocatalytic air purification.

* Thermally conductive materials

Copper foam has excellent thermal conductivity, which makes it a flame retardant material with excellent performance. In addition, people use copper foam to make heat dissipation materials for motors and appliances.

* Silencing and shielding materials

Copper foam is a very good silencing material. Sound waves will be diffusely reflected on the surface of the foamed copper, and the sound absorption effect is achieved through the principles of material expansion and microporous noise elimination. Cooper foam is also an excellent electromagnetic shielding material, and its shielding performance is close to silver.

* Filter material

Copper foam is basically harmless to the human body, which makes it successfully used as a medical filter material. At the same time, the application of copper foam in water purification devices has a good future.

* Fluid pressure buffer material

The dispersing and buffering action of the copper foam on the fluid makes it an excellent pressure reducing protection device for various pressure gauges.


Packing of Copper Foam

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’ Copper foam is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.

Chemical Identifiers

Linear FormulaCu
MDL NumberMFCD00010965
CAS #7440-50-8
EC No.231-159-6
Beilstein/Reaxys No.N/A
Pubchem CID23978
SMILES[Cu]
InchI IdentifierInChI=1S/Cu
InchI KeyRYGMFSIKBFXOCR-UHFFFAOYSA-N


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