Product Code : ME-Cu-6N-PO
Copper is a chemical element with the symbol Cu and atomic number 29. It is a soft, malleable, and ductile metal with very high thermal and electrical conductivity. A freshly exposed surface of pure copper has a pinkish-orange color. Copper is used as a conductor of heat and electricity, as a building material, and as a constituent of various metal alloys, such as sterling silver used in jewelry, cupronickel used to make marine hardware and coins, and constantan used in strain gauges and thermocouples for temperature measurement.
ATT specializes in producing high purity Copper Powder with the smallest possible average grain sizes for use in preparation of pressed and bonded sputtering targets and in Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Metallic-Organic and Chemical Vapor Deposition (MOCVD). Powders are also useful in any application where high surface areas are desired such as water treatment and in fuel cell and solar applications. Nanoparticles also produce very high surface areas. Our standard powder particle sizes average in the range of - 325 mesh, - 100 mesh, 10-50 microns and submicron (< 1 micron). We can also provide many materials in the nanoscale range.
Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.
| Product | Product Code | Purity | Size | Contact Us |
Product Information
Copper is a chemical element with the symbol Cu and atomic number 29. It is a soft, malleable, and ductile metal with very high thermal and electrical conductivity. A freshly exposed surface of pure copper has a pinkish-orange color. Copper is used as a conductor of heat and electricity, as a building material, and as a constituent of various metal alloys, such as sterling silver used in jewelry, cupronickel used to make marine hardware and coins, and constantan used in strain gauges and thermocouples for temperature measurement.
ATT specializes in producing high purity Copper Powder with the smallest possible average grain sizes for use in preparation of pressed and bonded sputtering targets and in Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Metallic-Organic and Chemical Vapor Deposition (MOCVD). Powders are also useful in any application where high surface areas are desired such as water treatment and in fuel cell and solar applications. Nanoparticles also produce very high surface areas. Our standard powder particle sizes average in the range of - 325 mesh, - 100 mesh, 10-50 microns and submicron (< 1 micron). We can also provide many materials in the nanoscale range.
Synonyms
Ultrafine copper powder type PMU
Copper Powder Specification
Dimensions
Size: Our standard powder particle sizes average in the range of - 325 mesh, - 100 mesh, 10-50 microns and submicron (< 1 micron). We can also provide many materials in the nanoscale range.
Per your request or drawing
We can customized as required
Copper Products
| Materials | Ni |
| Plate | √ |
| Sheet | √ |
| Strip | √ |
| Rod | √ |
| Sputtering Target | √ |
| Tube | √ |
Other: Spherical Copper Powder, Copper crucibles, Copper nuts, Copper bolts, Copper heating elements, and Copper shielding screens.
Properties（Theoretical）
| Molecular Weight | 63.55 |
| Appearance | Reddish Metal |
| Melting Point | 1085 °C |
| Boiling Point | 2562 °C |
| Density | 8.96 g/cm3 |
| Solubility in H2O | N/A |
| Electrical Resistivity | 1.673 μΩ-cm @ 20 °C |
| Electronegativity | 1.90 Paulings |
| Heat of Fusion | 13.26 kJ ·mol-1 |
| Heat of Vaporization | 300.4 kJ ·mol-1 |
| Poisson's Ratio | 0.34 |
| Specific Heat | 0.39 kJ/kg K |
| Thermal Conductivity | 401 W ·m-1 ·K-1 |
| Thermal Expansion | (25 °C) 16.5 µm·m-1·K-1 |
| Vickers Hardness | 369 MPa |
| Young's Modulus | 110–128 GPa |
| Temperature coefficient ( K⁻¹ ) | 0.00430 @0-100°C |
| Thermal emf against Pt (cold 0C - hot 100C) ( mV ) | 0.76 |
Chemical composition
Purity：6N（99.9999%）
| Element | Value |
| Zn | 100 PPM |
| Fe | 500 PPM |
| Sn | 100 PPM |
| Ca | 30 PPM |
| Mg | <10 PPM |
| Si | 10 PPM |
| B | <10 PPM |
| Al | <100 PPM |
| Ni | 300 PPM |
| Pb | 100 PPM |
| Ag | <100 PPM |
We can customized as required
Applications of Copper Powder
Copper powder can be used as a pigment in paint and ink.
Copper powder can be used as an abrasive.
Copper powder can be used in the production of certain types of glass.
Copper powder can be used as a catalyst.
Copper powder can be used in the production of certain types of plastics.
Packing of Copper Powder
Standard Packing:
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.
ATTs’ Copper Powder is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.
Chemical Identifiers
| Linear Formula | Cu |
| CAS | 7440-50-8 |
| MDL Number | MFCD00010965 |
| EC No. | 231-159-6 |
| Beilstein/Reaxys No. | N/A |
| Pubchem CID | 23978 |
| SMILES | [Cu] |
| InchI Identifier | InChI=1S/Cu |
| InchI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
