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Cobalt Aluminum (Co/Al) Sputtering Target

Product Code : ST-Co/Al-5N-Cu

Cobalt Aluminum (Co/Al) sputtering target is a type of thin film deposition target used in physical vapor deposition (PVD) processes to produce thin film coatings on various substrates. The Co/Al sputtering target comprises a mixture of cobalt and aluminum metals, which are carefully blended to achieve the desired ratio and uniformity.

Co/Al sputtering targets are typically made by powder metallurgy techniques or a casting process, which involve compacting and sintering the metal powders with high purity. The resulting sputtering targets have high density, excellent bonding strength, and superior purity, making them ideal for use in various sputtering applications.

One of the primary applications of Co/Al sputtering targets is in the manufacturing of magnetic recording media for hard disk drives (HDDs). Co/Al thin films are widely used in HDDs as an intermediate layer between the substrate and the magnetic layer. The Co/Al layer provides a smooth surface for the magnetic layer and enhances the magnetic properties of the disk, leading to improved performance of the HDD.

Co/Al sputtering targets are also used in the manufacturing of thin film-based sensors, such as gas sensors, biosensors, and magnetic sensors. The Co/Al thin films exhibit excellent magnetic properties, high corrosion resistance, and good adhesion to the substrate, making them suitable for use in various sensing applications.

In conclusion, Co/Al sputtering targets are an essential material in thin film deposition technology. They provide excellent adhesion, purity, and uniformity of the deposited thin films, making them useful for a wide range of applications, including HDDs and sensors.


Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Product Product Code Purity Size Contact Us
Cobalt Aluminum (Co/Al) Sputtering Target ST-Co/Al-2N-Cu 99% Customize
Cobalt Aluminum (Co/Al) Sputtering Target ST-Co/Al-3N-Cu 99.9% Customize
Cobalt Aluminum (Co/Al) Sputtering Target ST-Co/Al-4N-Cu 99.99% Customize
Cobalt Aluminum (Co/Al) Sputtering Target ST-Co/Al-5N-Cu 99.999% Customize

Product Information

Cobalt Aluminum (Co/Al) sputtering target is a type of thin film deposition target used in physical vapor deposition (PVD) processes to produce thin film coatings on various substrates. The Co/Al sputtering target comprises a mixture of cobalt and aluminum metals, which are carefully blended to achieve the desired ratio and uniformity.

Co/Al sputtering targets are typically made by powder metallurgy techniques or a casting process, which involve compacting and sintering the metal powders with high purity. The resulting sputtering targets have high density, excellent bonding strength, and superior purity, making them ideal for use in various sputtering applications.

One of the primary applications of Co/Al sputtering targets is in the manufacturing of magnetic recording media for hard disk drives (HDDs). Co/Al thin films are widely used in HDDs as an intermediate layer between the substrate and the magnetic layer. The Co/Al layer provides a smooth surface for the magnetic layer and enhances the magnetic properties of the disk, leading to improved performance of the HDD.

Co/Al sputtering targets are also used in the manufacturing of thin film-based sensors, such as gas sensors, biosensors, and magnetic sensors. The Co/Al thin films exhibit excellent magnetic properties, high corrosion resistance, and good adhesion to the substrate, making them suitable for use in various sensing applications.

In conclusion, Co/Al sputtering targets are an essential material in thin film deposition technology. They provide excellent adhesion, purity, and uniformity of the deposited thin films, making them useful for a wide range of applications, including HDDs and sensors.

Chemical Formula:Co/Al


Synonyms

N/A



Scandium (Sc) Sputtering Target Specification

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Size:

Circular   Sputtering TargetsDiameter1.0”2.0”3.0”4.0”5.0”6.0”up to 21”
Rectangular   Sputtering TargetsWidth x Length5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”
Thickness0.125”, 0.25”



Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.


Application of Cobalt Aluminum (Co/Al) Sputtering Target

Cobalt Aluminum (Co/Al) Target is mainly used in the electronics and information industry, glass coating field, wear-resistant materials, high-temperature corrosion resistance, high-grade decorative goods, and other industries.


Packing of  Cobalt Aluminum (Co/Al)Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’Cobalt Aluminum (Co/Al)  Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.



Chemical Identifiers

Linear FormulaCo-Al
MDL NumberMFCD00197977
EC No.N/A
Pubchem CID10261046
IUPAC Namealuminum; cobalt
SMILES[Al].[Co]
InchI IdentifierInChI=1S/Al.Co
InchI KeyMDKXFHZSHLHFLN-UHFFFAOYSA-N




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