Home > Products > Sputtering Targets & Evaporation Materials > Sputtering Targets > Silicon Nitride Sputtering Target, Si3N4

Silicon Nitride Sputtering Target, Si3N4

Product Code : ST-Si3N4-5N-Cu

Silicon nitride sputtering target is a type of nitride ceramic sputtering target. Si3N4 is a high-melting-point ceramic material that is extremely hard and relatively chemically inert. Si3N4 is prepared by heating powdered silicon between 1300 °C and 1400 °C in an atmosphere of nitrogen. Then the powder of silicon nitride can be sintered to the designed shape. Silicon nitride sputter target is used for thin film deposition.

Please contact us if you need customized services. We will contact you with the price and availability in 24 hours.

Product Product Code Purity Size Contact Us
Silicon Nitride Sputtering Target, Si3N4 ST-Si3N4-2N-Cu 99% Customize
Silicon Nitride Sputtering Target, Si3N4 ST-Si3N4-3N-Cu 99.9% Customize
Silicon Nitride Sputtering Target, Si3N4 ST-Si3N4-4N-Cu 99.99% Customize
Silicon Nitride Sputtering Target, Si3N4 ST-Si3N4-5N-Cu 99.999% Customize

Product Information

Silicon nitride sputtering target is a type of nitride ceramic sputtering target. Si3N4 is a high-melting-point ceramic material that is extremely hard and relatively chemically inert. Si3N4 is prepared by heating powdered silicon between 1300 °C and 1400 °C in an atmosphere of nitrogen. Then the powder of silicon nitride can be sintered to the designed shape. Silicon nitride sputter target is used for thin film deposition.

ATT provides high-quality Silicon nitride Sputtering Target for research and industry purposes at competitive prices. We can provide Silicon nitride Sputtering Target with different purity, size, and density according to your requirements.

Chemical Formula: Si3N4
CAS Number: 12033-89-5



Synonyms

N/A






Silicon Nitride Sputtering Target Specification

Size:

Circular   Sputtering TargetsDiameter1.0”2.0”3.0”4.0”5.0”6.0”up to 21”
Rectangular   Sputtering TargetsWidth x Length5” x 12”5” x 15”5” x 20”5” x 22”6” x 20”
Thickness0.125”, 0.25”

Shape: Disc/Rectangular/Tube

Bonding: Unbonding/Bonding

Per your request or drawing

We can customized as required

Properties(Theoretical)

Molecular Weight140.28
AppearanceSilvery
Melting PointN/A
Boiling PointN/A
Density2.2 to 3.5 g/cm3
Solubility in H2ON/A
Electrical Resistivity11 to 12 10x Ω-m
Poisson's Ratio0.24 to 0.27
Specific Heat720 to 800 J/kg-K
Thermal Conductivity12 to 31 W/m-K
Thermal Expansion2.5 to 3.2 µm/m-K
Young's Modulus140 to 310 GPa



Sputtering Targets Requirements

General requirements such as size, flatness, purity, impurity content, density, N/O/C/S, grain size, and defect control. Special requirements include surface roughness, resistance value, grain size uniformity, composition and tissue uniformity, magnetic conductivity, ultra-high density, ultra-fine grains, etc.


Application of Silicon Nitride Sputtering Target

Silicon nitride sputtering targets are used for CD-ROM, decoration, semiconductor, display, LED and photovoltaic devices, functional coating as nicely as other optical information storage space industry, glass coating industry like car glass and architectural glass, optical communication, etc.

Silicon nitride is one of the most thermodynamically stable technical ceramic material with high hardness as well, silicon nitride ceramic is ideal for bearing parts, especially for those required to work at high speed and high temperature. Silicon nitride has also been used in high-temperature applications, such as rocket engines. It was considered as one of the few monolithic ceramic materials that could survive the severe thermal shock and thermal gradients generated in hydrogen-oxygen rocket engines.



Packing of  Silicon Nitride Sputtering Target

Standard Packing:

Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes Special package is available on request.

ATTs’ Silicon Nitride Sputtering Target is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.



Chemical Identifiers

Linear FormulaSi3N4
MDL NumberMFCD00011230
EC No.234-796-8
Beilstein/Reaxys No.N/A
Pubchem CIDN/A
IUPAC NameN/A
SMILESN/A
InchI IdentifierN/A
InchI KeyN/A




Related Products
(518)606-3901
(518)606-3901