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Aluminum Nitride Sheet, AlN sheets

Product Code : CE-AlN-5N-SP

Aluminum nitride (AlN) is a new type of ceramic material with excellent comprehensive properties. Aluminum Nitrides (AlN) combine high thermal conductivity with strong electrical resistance, making AlN an excellent solution for many electronic applications. Unlike most electrically insulative materials — which are often also thermally insulative — AlN allows electrical systems to dissipate heat quickly in order to maintain maximum efficiency. Aluminum Nitride (AlN) is an excellent material to use if high thermal conductivity and electrical insulation properties are required, which makes it an ideal material for use in thermal management and electrical applications. Additionally, AlN is a common alternative to Beryllium Oxide (BeO) in the semiconductor industry as it is not a health hazard when machined. Aluminum Nitride has electrical insulation properties and a coefficient of thermal expansion that closely matches that of Silicon wafer material, making it a useful material for electronics applications where high temperatures and heat dissipation are often a problem. The series of excellent characteristics are considered to be the ideal materials for highly concentrated semiconductor substrates and electronic device packaging.

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Product Product Code Purity Size Contact Us
Aluminum Nitride Sheet, AlN sheetsCE-AlN-2N-SP 99%Sheet
Aluminum Nitride Sheet, AlN sheetsCE-AlN-3N-SP 99.9%Sheet
Aluminum Nitride Sheet, AlN sheetsCE-AlN-5N-SP 99.999%Sheet

Aluminum Nitride Sheet

An aluminum nitride (AlN) sheet is a thin, flat material composed primarily of aluminum nitride, a ceramic compound that has gained attention for its exceptional thermal conductivity, electrical insulation properties, and wide range of applications in various industries.

Key Characteristics of Aluminum Nitride

Thermal Conductivity: Aluminum nitride exhibits high thermal conductivity, making it an effective material for applications where heat dissipation is crucial, such as in electronic components.

Electrical Insulation: It is an excellent electrical insulator, which makes it suitable for applications that require electrical isolation along with thermal management.

Dielectric Properties: Aluminum nitride has low dielectric loss, allowing it to be used in high-frequency applications such as in microwave and radio frequency devices.

Chemical Stability: It is chemically stable and resistant to many common chemicals, which contributes to its suitability in various environments.

High Melting Point: Aluminum nitride has a high melting point, which enables its use in high-temperature applications.

Low Thermal Expansion: It has a relatively low coefficient of thermal expansion, which helps to minimize thermal stresses in devices that experience temperature variations.


Aluminum nitride; Azanylidynealumane; Nitridoalumane; Nitriloalumane; Nitridoaluminum

Aluminum Nitride (AlN) sheet Specification


Per your request or drawing

We can customized as required


Aluminum Nitride Properties

99%, 99.7%
Monoisotopic   Mass
Exact Mass
Melting Point°C2200
Boiling Point°C (dec.)2517
Electrical   ResistivityΩ-m10 to 12 10x
Poisson's Ratio
0.21 to 0.31
Specific HeatJ/kg-K780
Modulus of   ElasticityGPa320
racture   Toughness KICMpa m1/22.5
Compressive   StrengthMPa3000
Flexural   Strength @ 25°CMPa350
Thermal   Conductivity @ 25°CW/mK170
CTE 25°C ➞ 400°C10-6/K4.5
Maximum   Temperature (Inert)°C1200
Maximum   Temperature (Inert)1 MHz8.8
Dielectric   Loss1 MHz5x10-4
Dielectric   VoltagekV/mm15
Volume   Resistivity @ 25°Cohm-cm>1013

Hot Pressed Aluminum Nitiride

Flexural Strength, MOR (20 °C)MPa300 - 460
Fracture Toughness, KIcMPa m1/22.75 - 6.0
Thermal Conductivity (20 °C)W/m K80 - 100
Coefficient of Thermal Expansion1 x 10-6/°C3.3 - 5.5
Maximum Use Temperature°C800
Dielectric Strength (6.35mm)ac-kV/mm16.0 - 19.7
Dielectric Loss (tan δ)1MHz, 25 °C1 x 10-4 to 5 x 10-4
Volume Resistivity (25°C)Ω-cm1013 to 1014

Direct Sintered Aluminum Nitiride

Flexural Strength, MOR (20 °C)MPa260 - 375
Fracture Toughness, KIcMPa m1/23.0 - 3.6
Thermal Conductivity (20 °C)W/m K80 - 205
Coefficient of Thermal Expansion1 x 10-6/°C5.2 - 5.6
Maximum Use Temperature°C-
Dielectric Strength (6.35mm)ac-kV/mm15 - 25
Dielectric Loss (tan δ)1MHz, 25 °C0.0002 - 0.0077
Volume Resistivity (25°C)Ω-cm1011 to 1014


Over five times the thermal conductance of Alumina

Enables high performing devices to function faster and better in smaller devices

No toxic issues of beryllia

Good plasma resistance

Excellent thermal shock performance

Aluminum Nitride Machining

Aluminum Nitride can be machined in green, biscuit, or fully dense states. While in the green or biscuit form, it can be machined relatively easily into complex geometries. However, the sintering process that is required to fully densify the material causes the Aluminum Nitride body to shrink approximately 20%. This shrinkage means that it is impossible to hold very tight tolerances when machining AlN pre-sintering. In order to achieve very tight tolerances, fully sintered material must be machined/ground with diamond tools. In this process a very precise diamond coated tool/wheel is used to abrade away the material until the desired form is created. Due to the inherent toughness and hardness of the material, this can be a time consuming and costly process AlN commonly comes in substrates up to 1 mm thick, which can easily be laser cut. It can also come in thicker forms, however, it can be difficult/costly to manufacture in small quantities if the part requires custom material or significant machining.

Applications of Aluminum Nitride Sheet

•Heat sink substrate, LED package substrate, a semiconductor substrate, thin-film circuit •substrate, power resistor substrate


•Dielectric layers in optical storage media

•Electronic substrates, chip carriers where high thermal conductivity is essential;

•Military applications

• High power electrical insulators

• Power electronics

• Heat spreaders

• Heat sinks

• Water cooled heatsinks

• Laser heatsink power rectifiers

• Laser components

• Aerospace, power electronics

AlN ceramic products are mainly used in high-density hybrid circuits, microwave power devices, semiconductor power devices, power electronic devices, optoelectronic components, semiconductor refrigeration and other products as high-performance substrate materials and packaging materials.

Packing of Aluminum Nitride Sheet

Standard Packing:

Sealed bags in carton boxes. Special package is available on request.

As a ceramic material, AlN is quite fragile in a lot of cases. The AlN sheet are usually held in plastic bags by vacuum, and protected with heavy foam.

ATTs’ AlN sheet is carefully handled to minimize damage during storage and transportation and to preserve the quality of our products in their original condition.

Chemical Identifiers

Linear   FormulaAlN
MDL   NumberMFCD00003429
EC   No.246-140-8
Beilstein/Reaxys   No.N/A
Pubchem   CID90455
IUPAC   Nameazanylidynealumane
InchI   IdentifierInChI=1S/Al.N
InchI   Key


CAS # 24304-00-5

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